Semiconductor Engineering4h
How Companies Onboard Graduates And Shape University Curricula
Design and AI companies are using a range of tools to help graduates become productive more quickly. Some are feeding their ...
Semiconductor Engineering3d
Chip Industry Week In Review
The chip industry is still on track to hit $1 trillion annually by 2030, according to PWC‘s new State of the Semiconductor Industry report. Key drivers for growth are electrification, digitization, ...
Semiconductor Engineering4d
STCO for Dense Edge Architectures using 3D Integration and NVM (imec,, et al.)
Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory” was published by ...
Semiconductor Engineering5d
Critical Design Considerations For High-Bandwidth Chiplet Interconnects (TSMC)
Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions” was ...
Semiconductor Engineering5d
Pooling CPU Memory for LLM Inference With Lower Latency and Higher Throughput (UC Berkeley)
Pooling CPU Memory for LLM Inference” was published by researchers at UC Berkeley. Abstract “The rapid growth of LLMs has ...
Semiconductor Engineering5d
Aging, Complexity, And AI In Analog Design
Where digital and analog designs are overlapping, and why it's becoming more difficult to ensure they work as expected over ...
Semiconductor Engineering5d
Monitor Etch Defects on Dies in the Outer Regions Of The Wafer Using ISR
A technical paper titled “Detection of defective chips from nanostructures with a high-aspect ratio using hyperspectral ...
Semiconductor Engineering5d
Gate-All-Around: TCAD and DTCO Approach To Evaluate Power and Performance (imec, et al.)
A new technical paper titled “Exploring GAA-Nanosheet, Forksheet and GAA-Forksheet Architectures: a TCAD-DTCO Study at 90 nm & 120 nm Cell Height” was published by imec, Huawei Technologies and Global ...